Smart-Its Artefacts

The Smart-Its project is based on a philosophy of building and trying fully functional prototypes, and from day one the partners have begun to implement hardware/software artefacts that enable us to study issues in augmentation and networking of everyday objects. The device development is based on experience from the partner's previous research, for example conducted in the Europen project TEA, in TecO's Mediacup work, and in VTT's SoapBox development.

Our first device prototypes are based on two different microcontroller platforms, Atmel and PIC. The Atmel platform enables us to look into Bluetooth integration, while the PIC-based platform is used in conjunction with RFM communication. The overall device architecture is modular so that different sensor boards can be connected to either microcontroller platform.

This Smart-It is based on Atmel's ATmega103L microcontroller with 128 kB of in-system programmable flash memory and only 4 kB of SRAM. Ericsson's Bluetooth modules allow communication between different devices.

This device is integrates a PIC 16F876 20 MHz for processing, RFM 868 MHz for communication (128kbit/s), on board sensors and an I2C interface for sensor/actor boards. Power is supplied by 3V lithium cell.

RS232 Add-On (AR 0.0-0)

  • Interfaces to Smart-Its
  • RS232 level
  • IrDA physical layer
  • Power supply through main board (e.g. Smart-It)

I/O add: Temperature, Display, Sound (TDS 0.0-0)

  • Interface: I2C
  • 8 char x 2 line display
  • High-Resolution temperature sensor
  • Piezo sound
  • Power supply through main board (e.g. Smart-It)

Test I/O (IO-TS 0.0-0)

  • I/O Test board for input and output
  • Power supply through main board (e.g. Smart-It)